Description

Specifications Table

Product Name – Copper powder, -625 mesh, APS 2-3.50 micron, 99% (metals basis)
Quantity/Pack Size – 250g, 50g, 10g
Form – Powder
Grade – 99% (metals basis)
Application – Conductive coatings, chemical synthesis, metallurgy

Product Overview

This ultra-fine copper powder features a 99% metal basis purity with a tightly controlled particle size distribution of 2-3.50 microns (-625 mesh), ensuring exceptional consistency for demanding laboratory applications. The high surface area-to-volume ratio enhances reactivity while maintaining excellent electrical and thermal conductivity properties. Produced through advanced atomization techniques, this powder exhibits minimal oxidation and superior flow characteristics compared to conventional copper powders. The 99% purity level eliminates trace contaminants that could interfere with sensitive experiments or industrial processes. The uniform particle morphology provides predictable performance in applications requiring precise material deposition or homogeneous mixing. This grade is particularly valued for its balance between fine particle size and good handling properties, avoiding the agglomeration issues common with nanoscale copper powders while still delivering nanoscale-like performance benefits.

FAQs

1. What is the actual particle size distribution range for this copper powder?

The nominal particle size is 2-3.50 microns with a -625 mesh classification, meaning 100% of particles pass through a 625 mesh screen (20 micron opening).

2. Does this powder contain any anti-caking or flow agents?

This is a pure copper powder without any additives or processing aids that could affect its chemical properties.

3. What is the typical tap density for this grade of copper powder?

The apparent density typically ranges between 2.5-3.5 g/cm³ depending on handling conditions and compaction.

4. How does the 99% purity compare to 99.9% copper powders in terms of performance?

While slightly lower in purity, this 99% grade offers nearly identical electrical and thermal properties with better cost efficiency for most applications.