Description
Specifications Table
Product Name – Copper Thinfoil, 0.01mm (0.0004in) thick, 99.8% (metals basis)
Quantity/Pack Size – 100x100mm, 50x50mm, 25x25mm
Form – Foil
Grade – 99.8% (metals basis)
Application – Electronics, shielding, experimental setups
Product Overview
This 99.8% pure copper thinfoil offers exceptional conductivity and malleability, making it a critical component for precision laboratory applications. With a uniform thickness of 0.01mm (0.0004in), it ensures consistent performance in sensitive experiments and prototyping. The high-purity composition minimizes impurities, reducing the risk of contamination in delicate processes. Its corrosion-resistant properties extend its usability in varied environmental conditions, while the smooth surface finish allows for easy handling and cutting. The foil’s flexibility enables it to conform to complex shapes, making it suitable for custom applications. Available in multiple sheet sizes (100x100mm, 50x50mm, 25x25mm), it provides versatility for different project scales. The material’s thermal and electrical conductivity remains stable across a wide temperature range, ensuring reliable results in both low and high-temperature setups. Whether used for shielding, grounding, or as a conductive layer, this copper thinfoil delivers consistent performance for demanding lab requirements.
FAQs
1. What is the maximum temperature this copper thinfoil can withstand?
This 99.8% pure copper thinfoil maintains structural integrity up to 200°C under normal atmospheric conditions. Prolonged exposure to higher temperatures may affect its properties.
2. Can this foil be soldered directly without additional surface treatment?
The foil’s high-purity surface allows for direct soldering, though cleaning with isopropyl alcohol is recommended to remove any oxidative layer for optimal adhesion.
3. How does the 0.01mm thickness compare to standard copper foil?
At 0.01mm, this thinfoil is significantly thinner than standard 0.05mm or 0.1mm copper foils, offering greater flexibility while maintaining conductivity for precision applications.
4. Is this copper thinfoil compatible with adhesive backing?
While the foil itself doesn’t include adhesive, it can be paired with conductive adhesives or double-sided tapes for mounting, provided the adhesive is compatible with copper surfaces.
5. What’s the difference between 99.8% and 99.9% purity in copper foil?
The 0.1% difference primarily affects trace impurity levels; 99.8% purity is sufficient for most lab applications, while 99.9% may be preferred for semiconductor or high-vacuum environments.










