Description
Specifications Table
Product Name – Copper foil, 0.25mm (0.01in) thick, Puratronic™, 99.9985% (metals basis) Quantity/Pack Size – 100x100mm, 50x50mm Form – Foil Grade – Puratronic™, 99.9985% (metals basis) Application – High-precision lab experiments, electronics, research
Product Overview
This Puratronic™-grade copper foil delivers exceptional purity at 99.9985% (metals basis), making it a superior choice for applications demanding ultra-low impurity levels. With a consistent 0.25mm (0.01in) thickness, it ensures uniformity in experiments where precision is critical. The foil’s high conductivity and corrosion resistance make it suitable for advanced research, electronics prototyping, and specialized laboratory setups. Its Puratronic™ certification guarantees traceability and reliability, eliminating variability in results caused by material inconsistencies. Available in convenient 100x100mm and 50x50mm sizes, this copper foil is pre-cut for immediate use, reducing preparation time. The foil’s smooth surface minimizes oxidation risks during storage, while its malleability allows for easy shaping without compromising structural integrity. Ideal for environments where contamination control is paramount, this product adheres to strict quality standards, ensuring reproducibility in sensitive applications.
FAQs
1. What is the difference between Puratronic™ and standard copper foil?
Puratronic™ copper foil undergoes rigorous purification processes to achieve 99.9985% purity, significantly reducing trace impurities like oxygen, sulfur, and iron that are present in standard grades. This makes it more reliable for high-precision applications where even minor contaminants can affect outcomes.
2. Can this copper foil be used for soldering or circuit fabrication?
Yes, the 0.25mm thickness and high purity make it suitable for soldering and circuit prototyping, as it provides consistent electrical conductivity and minimal resistive losses. However, ensure proper flux and temperature control to avoid oxidation during soldering.
3. How should this copper foil be stored to prevent oxidation?
Store the foil in a dry, airtight container with desiccants to minimize exposure to moisture and oxygen. Avoid direct contact with corrosive chemicals or high humidity, as these can accelerate surface oxidation over time.
4. Is this foil compatible with acid etching processes?
The high purity of this copper foil makes it compatible with most acid etching techniques, but the choice of etchant (e.g., ferric chloride, ammonium persulfate) should be tested first to ensure uniform results without excessive pitting or residue.
5. Are there alternatives to this thickness for different applications?
Thinner foils (e.g., 0.1mm or 0.05mm) are available for flexible applications like EMI shielding, while thicker options (e.g., 0.5mm) may be preferred for structural or high-current applications. The 0.25mm thickness balances flexibility and durability for general lab use.
