Description
Specifications Table
Product Name – Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.998% (metals basis), Oxygen free
Quantity/Pack Size – 50x250mm, 50x50mm
Form – Foil
Grade – Puratronic™, 99.998% (metals basis), Oxygen-free
Application – High-precision electrical, thermal, and analytical applications
Product Overview
This high-purity copper foil, manufactured to Puratronic™ standards, delivers exceptional 99.998% (metals basis) purity with oxygen-free composition, ensuring superior electrical and thermal conductivity. The 0.5mm (0.02in) thickness provides durability while maintaining flexibility for intricate applications. Engineered for critical environments, this foil minimizes impurities that could compromise performance in sensitive experiments or industrial processes. Its uniform surface finish and consistent thickness make it ideal for applications requiring precise material properties. The foil is supplied in two convenient sizes—50x250mm and 50x50mm—to accommodate diverse project requirements without compromising quality. The oxygen-free characteristic eliminates oxidation risks, preserving conductivity over extended use. Whether for prototyping, research, or specialized manufacturing, this copper foil meets stringent purity standards for reliable, repeatable results.
FAQs
1. What is the significance of the 99.998% metals basis purity in this copper foil?
The 99.998% metals basis purity indicates that the copper contains only 0.002% trace impurities, ensuring minimal interference in electrical or thermal applications where even minor contaminants could affect performance.
2. How does the oxygen-free property benefit this copper foil?
Oxygen-free copper eliminates oxidation risks, which can degrade conductivity over time. This makes the foil more stable for long-term use in sensitive applications.
3. Can this foil be cut into custom sizes without affecting its properties?
Yes, the foil can be precision-cut to custom dimensions using appropriate tools, though care should be taken to avoid introducing contaminants during the process.
4. What is the difference between Puratronic™ grade and standard copper foil?
Puratronic™ grade copper undergoes rigorous refining to achieve ultra-high purity (99.998%), whereas standard foils may contain higher impurity levels that could impact performance.
5. Is this foil compatible with soldering or adhesive bonding?
The foil’s high purity and smooth surface make it suitable for soldering and adhesive bonding, though surface preparation (e.g., cleaning) may be required for optimal adhesion.
