Description
Specifications Table
Product Name – Copper foil, 0.25mm (0.01in) thick, hard, Puratronic™, 99.999+% (metals basis)
Quantity/Pack Size – 50x500mm, 50x100mm
Form – Foil
Grade – Puratronic™, 99.999+% (metals basis)
Application – High-precision lab experiments, electronics, thermal conductivity tests
Product Overview
This high-purity copper foil, with a 99.999% metals basis (Puratronic™ grade), is engineered for demanding laboratory applications where trace impurities can compromise results. The 0.25mm (0.01in) thickness ensures structural integrity while maintaining flexibility for intricate handling. Its hard temper provides durability, making it suitable for repeated use in experiments requiring consistent thermal or electrical conductivity. The foil’s ultra-low impurity profile minimizes interference in sensitive analytical procedures, such as spectroscopy or electrochemical testing. The Puratronic™ designation guarantees rigorous quality control, ensuring batch-to-batch reliability. Available in 50x500mm and 50x100mm dimensions, this foil adapts to both small-scale and larger experimental setups. Its smooth surface finish reduces the risk of contamination, while the copper’s inherent properties—high ductility, malleability, and corrosion resistance—make it a versatile choice for custom lab fabrications. Whether used as a substrate, electrode, or shielding material, this foil delivers precision performance in research and development environments.
FAQs
1. What is the difference between Puratronic™ and standard-grade copper foil?
Puratronic™ copper foil undergoes advanced purification to achieve 99.999% purity, eliminating trace metals and impurities that could affect experimental accuracy. Standard grades typically range between 99.9% and 99.95%, which may introduce variability in sensitive applications.
2. Can this foil be cut or shaped without compromising its properties?
Yes, the hard temper allows for clean cuts using precision tools like shears or laser cutters. However, avoid excessive mechanical stress, as it may alter the foil’s flatness or introduce micro-fractures. For intricate shapes, consider chemical etching methods.
3. Is this foil compatible with high-temperature applications?
The foil retains structural stability up to 200°C under normal conditions. Beyond this, oxidation may occur, affecting conductivity. For prolonged high-temperature use, an inert atmosphere or protective coating is recommended.
4. How should this foil be stored to prevent oxidation or contamination?
Store in a sealed, moisture-resistant container with desiccant packs. Avoid exposure to humid environments or corrosive vapors. For long-term storage, wrap in acid-free paper or place in a vacuum-sealed bag.
5. Are there alternatives for applications requiring softer or more malleable copper?
For projects needing higher ductility, consider annealed copper foil (soft temper) or oxygen-free copper grades. These offer easier forming but may have slightly lower purity or different thermal properties.
