Description
Specifications Table
Product Name – Indium, 99.99%, (trace metal basis), foil, 0.127 mm thick
Quantity/Pack Size – 2.3GR, 9.2GR
Form – Foil
Grade – 99.99% (trace metal basis)
Application – Thermal interface materials, soldering, semiconductor research
Product Overview
This 99.99% pure indium foil (trace metal basis) offers exceptional thermal and electrical conductivity with a uniform 0.127mm thickness, making it ideal for precision applications. The high-purity composition ensures minimal impurities, while the malleable nature allows for easy shaping and bonding. Indium’s low melting point (156.6°C) and excellent adhesion properties make it valuable in thermal interface materials, soldering applications, and semiconductor research. The foil format provides consistent surface quality for reliable performance in sensitive experiments. Each batch undergoes rigorous testing to maintain the specified purity level, ensuring reproducibility in critical applications. The material is packaged to prevent oxidation and maintain surface integrity during storage and handling. This product is particularly suitable for applications requiring high thermal conductivity and corrosion resistance.
FAQs
1. What is the melting point of this indium foil?
The melting point of this 99.99% pure indium foil is 156.6°C, which is significantly lower than many other metals.
2. Can this foil be used for vacuum applications?
Yes, this high-purity indium foil is suitable for vacuum applications due to its low outgassing properties when properly cleaned.
3. How should I store this indium foil to prevent oxidation?
Store in a cool, dry place in its original packaging or in an airtight container with desiccant to minimize oxidation.
4. What is the typical shelf life of this product?
When stored properly in unopened packaging, this indium foil maintains its properties for 2-3 years from the date of manufacture.
5. Is this foil compatible with other metals for soldering?
Yes, indium forms excellent alloys with many metals including tin, bismuth, and lead, making it versatile for various soldering applications.
